Materials for Advanced Packaging

Materials for Advanced Packaging,  2009 : Significant progress has been made in advanced packaging in recent years. Several new packaging techniques have been developed and new packaging materials have been introduced. This book provides a comprehensive overview of the recent developments in this industry, particularly in the areas of microelectronics, optoelectronics, digital health, and bio-medical applications. This book discusses established techniques, as well as emerging technologies, in order to provide readers with the most up-to-date developments in advanced packaging. TOC:Materials for 3D Packages.- Materials for Advanced Bonding/ Joining Techniques.- Materials for Advanced Interconnections.- Lead-Free Solders.- Materials for Wafer Processing (such as thinning).- Materials for Advanced Substrates (such as thin core or coreless substrates).- Materials for Advanced Underfill and Encapsulant.- Adhesives (ECA, Nano-ECA, Die Attach Adhesive).- Advanced Thermal Interface Materials.- Materials for Embedded Passives.- Nanomaterials/ Nanopackaging.- Wafer Level Packaging.- MEMS Packaging.- Optical Packaging.- Digital Health and Biomedical Packaging.